JPH0119400Y2 - - Google Patents

Info

Publication number
JPH0119400Y2
JPH0119400Y2 JP1984177259U JP17725984U JPH0119400Y2 JP H0119400 Y2 JPH0119400 Y2 JP H0119400Y2 JP 1984177259 U JP1984177259 U JP 1984177259U JP 17725984 U JP17725984 U JP 17725984U JP H0119400 Y2 JPH0119400 Y2 JP H0119400Y2
Authority
JP
Japan
Prior art keywords
package
recess
semiconductor device
main body
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984177259U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6192063U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984177259U priority Critical patent/JPH0119400Y2/ja
Priority to KR2019850013150U priority patent/KR900000826Y1/ko
Publication of JPS6192063U publication Critical patent/JPS6192063U/ja
Application granted granted Critical
Publication of JPH0119400Y2 publication Critical patent/JPH0119400Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1984177259U 1984-11-21 1984-11-21 Expired JPH0119400Y2 (en])

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1984177259U JPH0119400Y2 (en]) 1984-11-21 1984-11-21
KR2019850013150U KR900000826Y1 (ko) 1984-11-21 1985-10-10 반도체 장치의 팩키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984177259U JPH0119400Y2 (en]) 1984-11-21 1984-11-21

Publications (2)

Publication Number Publication Date
JPS6192063U JPS6192063U (en]) 1986-06-14
JPH0119400Y2 true JPH0119400Y2 (en]) 1989-06-05

Family

ID=30734830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984177259U Expired JPH0119400Y2 (en]) 1984-11-21 1984-11-21

Country Status (2)

Country Link
JP (1) JPH0119400Y2 (en])
KR (1) KR900000826Y1 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001015000A (ja) * 1999-04-26 2001-01-19 Sanyo Electric Co Ltd 電子部品の製造方法及び電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4824528U (en]) * 1971-07-27 1973-03-22
JPS5433421Y2 (en]) * 1974-10-30 1979-10-15
JPS5355469U (en]) * 1976-10-13 1978-05-12

Also Published As

Publication number Publication date
KR900000826Y1 (ko) 1990-01-30
KR860006725U (ko) 1986-06-25
JPS6192063U (en]) 1986-06-14

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